axial series led lamps lead-free parts pb doc. no : qw0905- rev. : date : data sheet LDGM9753-3 ligitek electronics co.,ltd. property of ligitek only LDGM9753-3 15 - apr. - 2008 a
0 25%50%75%100% 100%75%50%25% 60 30 0 -30 -60 ligitek electronics co.,ltd. property of ligitek only page 1/6 1.2 6.8 0.5 0.6 1.3 14.7 part no. LDGM9753-3 package dimensions 2 1 2 1 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 12.7
note : 1.the forward voltage data did not including ! 0.1v testing tolerance. 2. the luminous intensity data did not including ! 15% testing tolerance. absolute maximum ratings at ta=25 " i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 " ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 120 -30 ~ +100 -20 ~ +80 ir 500 50 ratings dgm 100 30 mw " v " # a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/6 60 viewing angle 2 $ 1/2 (deg) min. 900 40 typ. 3.5 forward voltage @ ma(v) max. 4.0 peak wave length % pnm 518 spectral halfwidth &% nm 36 typ. luminous intensity @40ma(mcd) 1500 emitted green part no LDGM9753-3 material ingan/gan lens color water clear dominant wave length % dnm 525 * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no. LDGM9753-3
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/6 page part no. LDGM9753-3
page 4/6 part no. LDGM9753-3 soldering heat max. 260 soldering heat ligitek electronics co.,ltd. property of ligitek only soldering iron: basic spec is Q 5 sec when 260 if temperature is higher, time should be shorter(+10 -1sec). power dissipation of iron should be smaller than 15w,and temperature should be controllable. surface temperature of the device should be under 230 . 245 5 within 5 sec preheat 120 ~ 150 120 ~ 180 sec reflow temp/time temp. ( ) 220 time preheat 150 120 60 ~ 120 sec 5sec rising +5 /sec cooling -5 /sec
page 5/6 part no. LDGM9753-3 ligitek electronics co.,ltd. property of ligitek only led led circuit model acircuit model b cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. precautions for use: storage time: 1.the operation of temperatures and rh are : 5 ~35 ,rh<60%. 2.once the package is opened, the products should be used within a week. otherwise, they should be kept in a damp proof box with descanting agent. considering the tape life, we suggest our customers to use our products within a year(from production date). 3.if opened more than one week in an atmosphere 5 ~ 35 ,rh<60%, they should be treated at 60 5 fo r 15hrs.
page 6/6 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reliability test: part no. LDGM9753-3 description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test operating life test test item the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test
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